Andrew P. Clarke

Consultant overview

Andy Clarke has spent 35 years developing reliable products and processes. His work has resulted in 20 U.S. patents, produced more than 30 critical trade secret filings and over a dozen published papers and technology awards. His training and experience have shaped a broad, physics-informed skill set that spans plasma processing, product development, and lean manufacturing.

He has helped clients and past employers resolve costly product design and manufacturing problems, often by identifying and developing simple, low-cost solutions.

How Andy can help

Andy helps companies solve complex technical challenges involving vacuum processing equipment, semiconductor and MEMS manufacturing, materials integration, process reliability, yield, and cycle time. He also provides advice on invention patentability, including prior art research, comparative analysis, and patent specification writing. Expert witness service in trade secret disputes and preparation of expert declarations are also offered.

• Vacuum process technology — process development and integration, equipment selection and physics-based analysis of systems
• Process reliability and yield — root-cause failure analysis, yield improvement, and cycle time reduction
• Capital equipment analysis and selection — tool evaluation, acceptance, technology roadmaps, budgets, and program timelines
• Patent services — patentability analysis, including prior art research and comparison, and patent specification writing
• Expert witness engagements — experienced expert witness in trade secret disputes, and declaration writing for ex parte patent reexaminations

Getting started

If a technical or manufacturing problem is costing your company money, but your team is too busy to give it the focused attention it requires, an outside perspective can help. Andy brings practical experience, technical depth, and a fresh point of view to help identify the root cause and develop an effective path forward.

Schedule a free 20-minute telephone consultation to discuss your situation. If the problem is a good fit for Andy’s expertise, he will provide his rates, terms, and availability.

Confidentiality: All communication is handled with absolute discretion.

Selected experience

PVD Technology Director, Plasma-Therm LLC (2023–2026) Managed product development for two PVD product lines.

Senior Principal Engineer, Raytheon (2013–2023) Developed manufacturable processes for detector and IC integration, improving yield and performance through innovation and failure analysis.

Technology Consultant & Expert Witness (2006–2013) Delivered manufacturing, process, materials and equipment solutions; served as expert witness in patent and trade secret litigation.

VP & General Manager, PVD Products Division, Tegal Corporation (2004–2006)

Founder & CEO, First Derivative Systems, Inc. (1999–2004)

Senior VP, Sputtered Films, Inc. (1989–1999)

US DOE Graduate Fellow, Los Alamos National Laboratory (1987–1989)

Education

• MS (USU) and BS (UCSB), Physics

Patents and technical contributions

Andy holds 20 U.S. patents, along with more than 30 trade secrets and over a dozen published papers and technology awards.

Reference Patent List

• U.S. Patent Number, Assignee / Short Description:
• 5,135,634 Sputtered Films, Inc. / Biasable water-cooled “Lens Shield” for the S-Gun
• 5,766,426 Sputtered Films, Inc. / Optical sight tube S-Gun anode and temperature feedback loop
• 6,086,947 Sputtered Films, Inc. / 212 TiN Barrier Film
• 6,235,656 First Derivative Systems / Method patent for the MDT Dual Degas/Cool Single-wafer Loadlock
• 6,562,141 First Derivative Systems / Device patent for the MDT Dual Degas/Cool Single-wafer Loadlock
• 6,605,198 Sputtered Films, Inc. / Device patent for the biasable S-Gun anode (PJC primary)
• 6,830,664 First Derivative Systems / Magnetically enhanced hollow cathode array sputter source
• 8,663,389 The PVD Group / Membrane Assisted Semi-Closed (MASC) Reactor for HVPE growth of GaN
• 10,515,905 Raytheon Vision Systems / SiN stress compensation layer
• 11,101,130 Raytheon Vision Systems / Filling Vias with Eutectic Compositions
• 11,410,937 Raytheon Vision Systems / AlN stress buffer layer for HgCdTe bonding oxide deposition
• 11,659,660 Raytheon Vision Systems / Oxide TGV stress buffer liner to avoid glass substrate cracking
• 11,817,521 Raytheon Vision Systems / P-type Si contact intermediary between formed NiSi and HgCdTe
• 11,851,785 Raytheon Vision Systems / AlN passivation for HgCdTe device to prevent Hg loss
• 11,854,879 Raytheon Vision Systems / Cu3Sn via metallization for TSV fusion bond
• 11,894,477 Raytheon Vision Systems / AlN stress buffer and stress compensation for wafer bonding to HgCdTe
• 12,002,773 Raytheon Vision Systems / Hybrid Pocket Post for 3D Integration
• 12,354,911 Raytheon Vision Systems / Division of 11,854,879 B2: Cu3Sn via metallization for TSV fusion bond
• 12,593,525 Raytheon Vision Systems / Offset Vertical Interconnect for 3D wafer Integration with HgCdTe
• 12,684,896 Raytheon Vision Systems / Integrated 3D MCT Wafer Process Incorporating AlN Stress and Buffer Layers